FLO/PCB 3.0 for Allegro解决板级设计中的热问题

日期:2006-01-05

 


Cadence?and Flomerics Limited are delighted to invite you to attend the following complimentary web seminar. Enjoy a 60 minute opportunity to catch-up with the latest technology.

This web seminar will demonstrate how Allegro?PCB Editor is now tightly integrated with FLO/PCB, the PCB level thermal modelling tool from Flomerics to provide the ability to quickly and easily predict thermal performance throughout PCB layout design.

Simply click on the link below to register:

 

Technology:

Silicon-Package-Board

Presentation Title:

Realising a thermally aware PCB Design Process

Presenter:

Robin Bornoff, Flomerics

Date:

22 February 2006

UK Time:

1000am

 

 

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